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Unpublished TDP values for certain Chinese and custom chips

Identify the Thermal Design Power (TDP) values for Chinese AI accelerators and custom silicon (e.g., Google’s TPU v5p) lacking publicly available specifications to enable consistent power requirement estimation.

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Background

Power requirement estimates depend on TDP figures, which are missing for some Chinese and custom chips. Obtaining reliable TDP values would improve power modeling accuracy and cross‑system comparisons.

References

We collected Thermal Design Power (TDP) for most chips when publicly available, though we did not find the TDP for some Chinese chips and custom silicon such as Google's TPU v5p.

— Trends in AI Supercomputers (2504.16026 - Pilz et al., 22 Apr 2025) in Appendix: Methods — Power requirements