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Quest for a solution to drift in phase change memory devices

Published 5 Jan 2024 in physics.app-ph, cond-mat.dis-nn, and cs.ET | (2401.09462v1)

Abstract: The goal of this thesis is to gain new insights into the drift phenomenon and identify strategies to mitigate it. An extensive experimental characterization of PCM devices and in particular drift forms the foundation of each chapter. With respect to time-scales, ambient temperature, device dimensions, and combinations thereof, drift is studied under unprecedented conditions. In three studies, different aspects of drift are examined. (1) The origin of structural relaxation: Drift measurements over 9 orders of magnitude in time reveal the onset of relaxation in a melt-quenched state. The data is used to appraise two models, the Gibbs relaxation model and the collective relaxation model. Additionally, a refined version of the collective relaxation model is introduced and the consequences of a limited number of structural defects are discussed. (2) Exploiting nanoscale effects in phase change memories: Scaling devices to ever-smaller dimensions is incentivized by the requirement to achieve higher storage densities and less power consumption. Eventually, confinement and interfacial effects will govern the device characteristics. Anticipating these consequences, the feasibility to use a single element, Antimony, is assessed for the first time. The power efficiency, stability against crystallization, and drift are characterized under different degrees of confinement. (3) State-dependent drift in a projected memory cell: New device concepts are aiming to reduce drift by decoupling the cell resistance from the electronic properties of the amorphous phase. A shunt resistor scaling with the amount of amorphous material is added. Simulations and the drift characteristics of a projected device put the idealized concept to the test. The contact resistance between the phase change material and the shunt resistor is identified as a decisive parameter to achieve the desired device properties.

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References (196)
  1. Anomalous low-temperature thermal properties of glasses and spin glasses. Philos. Mag., 25(1):1–9.
  2. Relaxation in glassforming liquids and amorphous solids. J. Appl. Phys., 88(6):3113–3157.
  3. Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications embedding 16MB Phase Change Memory. In Tech. Dig. - Int. Electron Devices Meet. IEDM, volume 2018-Decem, pages 18.4.1–18.4.4. Institute of Electrical and Electronics Engineers Inc.
  4. ASSOCIATION, J. S. S. T. (2003). Double Data Rate (DDR) SDRAM Specification.
  5. AWS (2020). AWS Inferentia - Amazon Web Services (AWS).
  6. On the explosive semiconductor‐semimetal transition of antimony. Phys. Status Solidi, 31(1):165–170.
  7. Banta, M. C. E. (2021). IBM Unveils On-Chip Accelerated Artificial Intelligence Processor.
  8. Physical origin of the resistance drift exponent in amorphous phase change materials. Appl. Phys. Lett., 98(24):1–4.
  9. Statistics of resistance drift due to structural relaxation in phase-change memory arrays. IEEE Trans. Electron Devices, 57(10):2690–2696.
  10. A physics-based model of electrical conduction decrease with time in amorphous Ge2 Sb2 Te5. J. Appl. Phys., 105(8).
  11. Internal temperature extraction in phase-change memory cells during the reset operation. IEEE Electron Device Lett., 33(4):594–596.
  12. Impact of conductance drift on multi-PCM synaptic architectures. NVMTS 2018 - Non-Volatile Mem. Technol. Symp. 2018, pages 9–12.
  13. Mushroom-Type phase change memory with projection liner: An array-level demonstration of conductance drift and noise mitigation. In IEEE Int. Reliab. Phys. Symp. Proc., volume 2021-March. Institute of Electrical and Electronics Engineers Inc.
  14. Nanosecond switching in GeTe phase change memory cells. Appl. Phys. Lett., 95(4).
  15. Phase change memory technology. J. Vac. Sci. Technol. B, Nanotechnol. Microelectron. Mater. Process. Meas. Phenom., 28(2):223–262.
  16. Experimental Demonstration and Tolerancing of a Large-Scale Neural Network (165 000 Synapses) Using Phase-Change Memory as the Synaptic Weight Element. IEEE Trans. Electron Devices, 62(11):3498–3507.
  17. Evidence of the thermo-electric thomson effect and influence on the program conditions and cell optimization in phase-change memory cells. In Tech. Dig. - Int. Electron Devices Meet. IEDM, number January, pages 315–318.
  18. Size-dependent and tunable crystallization of GeSbTe phase-change nanoparticles. Sci. Rep., 6(November):1–10.
  19. Structure relaxation spectrum of metallic glasses. Appl. Phys. Lett., 28(5):245–247.
  20. Molecular theory of physical aging in polymer glasses. Phys. Rev. Lett., 98(16):1–4.
  21. Chemical understanding of resistance drift suppression in Ge-Sn-Te phase-change memory materials. J. Mater. Chem. C, 8(1):71–77.
  22. Ultra-thin phase-change bridge memory device using GeSb. Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 10–13.
  23. The impact of film thickness and melt-quenched phase on the phase transition characteristics of Ge2 Sb2 Te5. J. Appl. Phys., 107(7):074308.
  24. Functional Demonstration of a Memristive Arithmetic Logic Unit (MemALU) for In‐Memory Computing. Adv. Funct. Mater., 29(49):1905660.
  25. Antimony thin films demonstrate programmable optical nonlinearity. Sci. Adv., 7(1):1–10.
  26. Study on the resistance drift in amorphous Ge 2Sb 2Te 5 according to defect annihilation and stress relaxation. Electrochem. Solid-State Lett., 15(4):81–84.
  27. Choe, J. (2017). Intel 3D XPoint Memory Die Removed from Intel Optane™ PCM (Phase Change Memory).
  28. Modeling of threshold-voltage drift in phase-change memory (PCM) devices. IEEE Trans. Electron Devices, 59(11):3084–3090.
  29. A 256-mcell phase-change memory chip operating at 2+ bit/cell. IEEE Trans. Circuits Syst. I Regul. Pap., 60(6):1521–1533.
  30. Review of electrical contacts to phase change materials and an unexpected trend between metal work function and contact resistance to germanium telluride. J. Vac. Sci. Technol. A, 38(5):050805.
  31. Crandall, R. S. (1991). Defect relaxation in amorphous silicon: Stretched exponentials, the Meyer-Neldel rule, and the Staebler-Wronski effect. Phys. Rev. B, 43(5):4057–4070.
  32. The density and viscosity of liquid antimony. Metall. Trans., 3(1):157–159.
  33. Crine, J. P. (1991). The Compensation Law Revisited: Application to Dielectric Aging. IEEE Trans. Electr. Insul., 26(4):811–818.
  34. Electrical conductivity and thermoelectric power of amorphous Sb2Te3 thin films and amorphous-crystalline transition.
  35. Dash, J. G. (1989). Surface melting. Contemp. Phys., 30(2):89–100.
  36. Evidence of Crystallization–Induced Segregation in the Phase Change Material Te-Rich GST. J. Electrochem. Soc., 158(10):H965.
  37. Phase-change heterostructure enables ultralow noise and drift for memory operation. Science (80-. )., 366(6462):210–215.
  38. Competing Crystal Growth in Ge-Sb Phase-Change Films. Adv. Funct. Mater., 24(12):1687–1694.
  39. Stress-induced crystallization of Ge-doped Sb phase-change thin films. Cryst. Growth Des., 13(1):220–225.
  40. Elfalaky, A. (1995). Antimony thin-film transport properties and size effect. Appl. Phys. A Mater. Sci. Process., 60(1):87–91.
  41. Elliott, S. R. (2020). Electronic mechanism for resistance drift in phase-change memory materials: Link to persistent photoconductivity. J. Phys. D. Appl. Phys., 53(21).
  42. Band gap widening with time induced by structural relaxation in amorphous Ge 2Sb 2Te 5 films. Appl. Phys. Lett., 100(1).
  43. Phase-Change Memory - Towards a Storage-Class Memory. IEEE Trans. Electron Devices, 64(11):4374–4385.
  44. Observation of surface melting. Phys. Rev. Lett., 54(2):134–137.
  45. Study of structural relaxation of metallic glasses by stress-free dilatometry. J. Phys. Condens. Matter, 1(44):8305–8318.
  46. Atomistic Simulations of the Crystallization and Aging of GeTe Nanowires. J. Phys. Chem. C, 121(42):23827–23838.
  47. Microscopic origin of resistance drift in the amorphous state of the phase-change compound GeTe. Phys. Rev. B - Condens. Matter Mater. Phys., 92(5):1–9.
  48. Subthreshold electrical transport in amorphous phase-change materials. New J. Phys., 17(9):93035.
  49. Projected Mushroom Type Phase‐Change Memory. Adv. Funct. Mater., page 2106547.
  50. 8-bit Precision In-Memory Multiplication with Projected Phase-Change Memory. Tech. Dig. - Int. Electron Devices Meet. IEDM, 2018-Decem:27.7.1–27.7.4.
  51. In‐Memory Database Query. Adv. Intell. Syst., 2(12):2000141.
  52. Activation energy spectra and relaxation in amorphous materials. J. Mater. Sci., 18(1):278–288.
  53. Google (2021). Cloud Tpu — Cloud TPU — Google Cloud.
  54. Resistance Drift and Crystallization in Suspended and On-oxide Phase Change Memory Line Cells. Proc. IEEE Conf. Nanotechnol., 2019-July:417–420.
  55. Degradation of the reset switching during endurance testing of a phase-change line cell. IEEE Trans. Electron Devices, 56(2):354–358.
  56. Greer, A. L. (1982). Effect of quench rate on the structural relaxation of a metallic glass. J. Mater. Sci., 17(4):1117–1124.
  57. Greer, A. L. (2015). New horizons for glass formation and stability. Nat. Mater., 14(6):542–546.
  58. Crystallization-induced stress in thin phase change films of different thicknesses. Appl. Phys. Lett., 93(22).
  59. An Edge Contact Type Cell for Phase Change RAM Featuring Very Low Power Consumption. In Dig. Tech. Pap. - Symp. VLSI Technol., pages 175–176.
  60. Hashimoto, M. (1984). The crystallization rate of vacuum-deposited amorphous antimony (a-Sb) films was investigated as a function of the film thickness. Thin Solid Films, 116:373–381.
  61. Contact resistance measurement of Ge 2Sb 2Te 5 phase change material to TiN electrode by spacer etched nanowire. Semicond. Sci. Technol., 29(9):095003.
  62. Irreversible structural relaxation in amorphous Pd82Si 18: A two-level-systems analysis. J. Phys. Condens. Matter, 2(6):1425–1434.
  63. Common signature of many-body thermal excitation in structural relaxation and crystallization of chalcogenide glasses. Appl. Phys. Lett., 94(9).
  64. Recovery and drift dynamics of resistance and threshold voltages in phase-change memories. IEEE Trans. Electron Devices, 54(2):308–315.
  65. Physical interpretation, modeling and impact on phase change memory (PCM) reliability of resistance drift due to chalcogenide structural relaxation. In Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 939–942.
  66. Temperature acceleration of structural relaxation in amorphous Ge 2 Sb2 Te5. Appl. Phys. Lett., 92(19):3–6.
  67. Reliability impact of chalcogenide-structure relaxation in phase-change memory (PCM) cells-Part I: Experimental study. IEEE Trans. Electron Devices, 56(5):1070–1077.
  68. In-memory computing with resistive switching devices. Nat. Electron., 1(6):333–343.
  69. Analytical model for subthreshold conduction and threshold switching in chalcogenide-based memory devices. J. Appl. Phys., 102(5).
  70. Intel (2017). Revolutionizing Memory and Storage.
  71. Jackson, W. B. (1988). Connection between the Meyer-Neldel relation and multiple-trapping transport. Phys. Rev. B, 38(5):3595–3598.
  72. Ultrafast characterization of phase-change material crystallization properties in the melt-quenched amorphous phase. Nano Lett., 14(6):3419–3426.
  73. Investigation of trap spacing for the amorphous state of phase-change memory devices. IEEE Trans. Electron Devices, 58(12):4370–4376.
  74. Accurate deep neural network inference using computational phase-change memory. Nat. Commun., 11(1):1–13.
  75. Synthesis and characterization of Ge2Sb2Te 5 nanowires with memory switching effect. J. Am. Chem. Soc., 128(43):14026–14027.
  76. Impact of defect occupation on conduction in amorphous Ge2Sb2Te5. Sci. Rep., 6(August).
  77. Viscosity and elastic constants of thin films of amorphous Te alloys used for optical data storage. J. Appl. Phys., 94(8):4908–4912.
  78. PRAM cell technology and characterization in 20nm node size. Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 39–42.
  79. Fundamental drift of parameters in chalcogenide phase change memory. J. Appl. Phys., 102(12).
  80. State dependence and temporal evolution of resistance in projected phase change memory. Sci. Rep., 10(1):1–11.
  81. Exploiting nanoscale effects in phase change memories. Faraday Discuss., 213:357–370.
  82. Measurement of Onset of Structural Relaxation in Melt-Quenched Phase Change Materials. Adv. Funct. Mater., 31(37).
  83. HERMES Core-A 14nm CMOS and PCM-based In-Memory Compute Core using an array of 300ps/LSB Linearized CCO-based ADCs and local digital processing. IEEE Symp. VLSI Circuits, Dig. Tech. Pap., 2021-June:5–6.
  84. Evidence of distributed interstitialcy-like relaxation of the shear modulus due to structural relaxation of metallic glasses. Phys. Rev. Lett., 100(6):1–4.
  85. High performance PRAM cell scalable to sub-20nm technology with below 4F2 cell size, extendable to DRAM applications. Dig. Tech. Pap. - Symp. VLSI Technol., (July):203–204.
  86. A phase change memory cell with metallic surfactant layer as a resistance drift stabilizer. Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 762–765.
  87. High-performance, cost-effective 2z nm two-deck cross-point memory integrated by self-align scheme for 128 Gb SCM. In Tech. Dig. - Int. Electron Devices Meet. IEDM, volume 2018-Decem, pages 37.1.1–37.1.4. Institute of Electrical and Electronics Engineers Inc.
  88. ALD-based confined PCM with a metallic liner toward unlimited endurance. Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 4.2.1–4.2.4.
  89. Crystallization of amorphous antimony films. Thin Solid Films, 34(1):37–40.
  90. Relaxation kinetics of nanoscale indents in a polymer glass. Phys. Rev. Lett., 102(11):102–105.
  91. Projected phase-change memory devices. Nat. Commun., 6(May):8181.
  92. Log T Dependence of Resistivity and Negative Magnetoresistance in the Layered Compound TiTei. J. Phys. Soc. Japan, 52(2):597–604.
  93. Revealing the intrinsic nature of the mid-gap defects in amorphous Ge2Sb2Te5. Nat. Commun., 10(1).
  94. Chalcogenides by Design: Functionality through Metavalent Bonding and Confinement. Adv. Mater., 32(21).
  95. Krebs, D. (2010). Electrical transport and switching in phase change materials. PhD Thesis, page 199.
  96. Changes in electrical transport and density of states of phase change materials upon resistance drift. New J. Phys., 16.
  97. Threshold field of phase change memory materials measured using phase change bridge devices. Appl. Phys. Lett., 95(8):1–4.
  98. Impact of DoS changes on resistance drift and threshold switching in amorphous phase change materials. J. Non. Cryst. Solids, 358(17):2412–2415.
  99. Determination of the effective attempt frequency of irreversible structural relaxation processes in amorphous alloys by anisothermal measurements. Phys. Status Solidi, 131(2):391–402.
  100. Low-cost and nanoscale non-volatile memory concept for future silicon chips. Nat. Mater., 4(4):347–352.
  101. Le Gallo, M. (2017). Phase-Change Memory:Device Physics and application to non-von Neumann Computing. Phd thesis, ETH Zurich.
  102. Evidence for thermally assisted threshold switching behavior in nanoscale phase-change memory cells. J. Appl. Phys., 119(2).
  103. Collective Structural Relaxation in Phase-Change Memory Devices. Adv. Electron. Mater., 4(9):1700627.
  104. Compressed Sensing with Approximate Message Passing Using In-Memory Computing. IEEE Trans. Electron Devices, 65(10):4304–4312.
  105. The complete time/temperature dependence of I-V drift in PCM devices. IEEE Int. Reliab. Phys. Symp. Proc., 2016-Septe:MY11–MY16.
  106. Leather, A. (2015). Intel And Micron Announce Breakthrough Faster-Than-Flash 3D XPoint Storage Technology.
  107. Lee, B.-s. (2009). Observation of the Role of Subcritical. Science (80-. )., 980(November):980–985.
  108. Mechanical stresses upon crystallization in phase change materials. Appl. Phys. Lett., 79(22):3597–3599.
  109. Understanding phase-change materials with unexpectedly low resistance drift for phase-change memories. J. Mater. Chem. C, 6(13):3387–3394.
  110. On the density of states of germanium telluride. J. Appl. Phys., 112(11):113714.
  111. Investigation of defect states in the amorphous phase of phase change alloys GeTe and Ge2Sb2Te5. Phys. Status Solidi Curr. Top. Solid State Phys., 7(3-4):852–856.
  112. Stoichiometry dependence of resistance drift phenomena in amorphous GeSnTe phase-change alloys. J. Appl. Phys., 113(2).
  113. Luckas, J. M. (2013). Electronic transport in amorphous phase-change materials. PhD thesis, RWTH Aachen.
  114. Germanium telluride (GeTe) heat capacity, density, melting point. In Non-Tetrahedrally Bond. Elem. Bin. Compd. I, pages 1–3. Springer-Verlag.
  115. McKenna, G. B. (2003). Mechanical rejuvenation in polymer glasses: Fact or fallacy? J. Phys. Condens. Matter, 15(11).
  116. In situ transmission electron microscopy observation of nanostructural changes in phase-change memory. ACS Nano, 5(4):2742–2748.
  117. Relation between the energy constant and the quantity constant in the conductivity–temperature formula of oxide semiconductors. Zeitschrift für Tech. Phys., 18(12):588.
  118. Micron (2021). Micron Updates Data Center Portfolio Strategy to Address Growing Opportunity for Memory and Storage Hierarchy Innovation — Micron Technology.
  119. Extremely low drift of resistance and threshold voltage in amorphous phase change nanowire devices. Appl. Phys. Lett., 96(22).
  120. Amorphization of pure hafnium nanocontacts and continuous conductance control via phase transition treatment using nanosecond pulse voltage energization. Jpn. J. Appl. Phys., 58(5).
  121. Structural transformation between crystal and amorphous states and relating conductance variation in pure molybdenum nanocontacts. Jpn. J. Appl. Phys., 58(3).
  122. Precision of synaptic weights programmed in phase-change memory devices for deep learning inference. Int. Electron Devices Meet., 5:29.4.1–29.4.4.
  123. Mixed-precision architecture based on computational memory for training deep neural networks. In Proc. - IEEE Int. Symp. Circuits Syst., volume 2018-May. Institute of Electrical and Electronics Engineers Inc.
  124. Fully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-Format. IEEE Trans. Electron Devices, pages 13–14.
  125. The resistivity and thermoelectric power of liquid antimony.
  126. Write strategies for 2 and 4-bit multi-level phase-change memory. Tech. Dig. - Int. Electron Devices Meet. IEDM, pages 461–464.
  127. Density changes upon crystallization of Ge2Sb2.04Te4.74 films. J. Vac. Sci. Technol. A Vacuum, Surfaces, Film., 20(1):230–233.
  128. Evolution of cell resistance, threshold voltage and crystallization temperature during cycling of line-cell phase-change random access memory. J. Appl. Phys., 110(2).
  129. The influence of resistance drift on measurements of the activation energy of conduction for phase-change material in random access memory line cells. J. Appl. Phys., 112(8).
  130. Charge collection microscopy of in - Situ switchable PRAM line cells in a scanning electron microscope: Technique development and unique observations. Rev. Sci. Instrum., 86(3).
  131. Ultra-fast calorimetry study of Ge 2Sb 2Te 5 crystallization between dielectric layers. Appl. Phys. Lett., 101(9):091906.
  132. ELECTRONIC TRANSPORT IN HYDROGENATED AMORPHOUS-SEMICONDUCTORS-INTRODUCTION. SPRINGER TRACTS Mod. Phys., 114.
  133. Ovshinsky, S. R. (1968). Reversible electrical switching phenomena in disordered structures. Phys. Rev. Lett., 21(20):1450–1453.
  134. Amorphous Semiconductors for Switching, Memory, and Imaging Applications. IEEE Trans. Electron Devices, ED-20(2):91–105.
  135. Influence of capping layers on the crystallization of doped Sb xTe fast-growth phase-change films. J. Appl. Phys., 100(12).
  136. Drift-Tolerant Multilevel Phase-Change Memory. IEEE, pages 3–6.
  137. Programming algorithms for multilevel phase-change memory. Proc. - IEEE Int. Symp. Circuits Syst., pages 329–332.
  138. Novel μ𝜇\muitalic_μtrench phase-change memory cell for embedded and stand-alone non-volatile memory applications. Dig. Tech. Pap. - Symp. VLSI Technol., pages 18–19.
  139. Electrical behavior of phase-change memory cells based on GeTe. IEEE Electron Device Lett., 31(5):488–490.
  140. Electronic Switching in Phase-Change Memories. IEEE Trans. Electron Devices, 51(3):452–459.
  141. Low-field amorphous state resistance and threshold voltage drift in chalcogenide materials. IEEE Trans. Electron Devices, 51(5):714–719.
  142. Priestley, R. D. (2009). Physical aging of confined glasses. Soft Matter, 5(5):919–926.
  143. Materials Science: Structural relaxation of polymer glasses at surfaces, interfaces, and in between. Science (80-. )., 309(5733):456–459.
  144. Primak, W. (1955). Kinetics of processes distributed in activation energy. Phys. Rev., 100(6):1677–1689.
  145. Reducing the stochasticity of crystal nucleation to enable subnanosecond memory writing. Science (80-. )., 358(6369):1423–1427.
  146. Phase-change random access memory: A scalable technology. IBM J. Res. Dev., 52(4-5):465–479.
  147. Influence of interfaces and doping on the crystallization temperature of Ge-Sb. Appl. Phys. Lett., 94(18):2007–2010.
  148. Crystallization properties of ultrathin phase change films. J. Appl. Phys., 103(11).
  149. Phase change materials and their application to random access memory technology. Microelectron. Eng., 85(12):2330–2333.
  150. Phase change materials and phase change memory. MRS Bull., 39(8):703–710.
  151. Aging mechanisms in amorphous phase-change materials. Nat. Commun., 6(May):1–8.
  152. EP2034536B1 - Phase change memory device for multibit storage.
  153. Energy landscape model of conduction and phase transition in phase change memories. IEEE Trans. Electron Devices, 60(11):3618–3624.
  154. Role of mechanical stress in the resistance drift of Ge2Sb 2Te5 films and phase change memories. Appl. Phys. Lett., 99(22).
  155. Analytical solution for the kissinger equation. J. Mater. Res., 24(10):3095–3098.
  156. Localised states and their capture characteristics in amorphous phase-change materials. Sci. Rep., 9(1):1–10.
  157. Relation between bandgap and resistance drift in amorphous phase change materials. Sci. Rep., 5(1):17362.
  158. Phase change random access memory, thermal analysis. In Thermomechanical Phenom. Electron. Syst. -Proceedings Intersoc. Conf., volume 2006, pages 660–665.
  159. Measurement of crystal growth velocity in a melt-quenched phase-change material. Nat. Commun., 4.
  160. Monatomic phase change memory. Nat. Mater., 17(8):681–685.
  161. Cooperative motion and growing length scales in supercooled confined liquids. Europhys. Lett., 59(5):701–707.
  162. The Relaxation Dynamics of a Supercooled Liquid Confined by Rough Walls † . J. Phys. Chem. B, 108(21):6673–6686.
  163. Schroder, D. K. (2005). Semiconductor Material and Device Characterization: Third Edition, volume 44.
  164. Schroers, J. (2014). Condensed-matter physics: Glasses made from pure metals.
  165. A collective relaxation model for resistance drift in phase change memory cells. IEEE Int. Reliab. Phys. Symp. Proc., 2015-May(1):MY51–MY56.
  166. Crystal growth within a phase change memory cell. Nat. Commun., 5.
  167. Non-resistance-based cell-state metric for phase-change memory. J. Appl. Phys., 110(8):1–7.
  168. Temporal correlation detection using computational phase-change memory. Nat. Commun., 8(1):1115.
  169. Size-dependent viscosity in the super-cooled liquid state of a bulk metallic glass. Appl. Phys. Lett., 102(22).
  170. Activation-energy spectrum and structural relaxation dynamics of amorphous silicon. Phys. Rev. B, 48(9):5964–5972.
  171. Realization of Boolean Logic Functionality Using Redox-Based Memristive Devices. Adv. Funct. Mater., 25(40):6414–6423.
  172. Toward the ultimate limit of phase change in Ge2Sb 2Te5. Nano Lett., 10(2):414–419.
  173. Nanoscale size effects in crystallization of metallic glass nanorods. Nat. Commun., 6:1–6.
  174. Tailoring crystallization phases in metallic glass nanorods via nucleus starvation. Nat. Commun., 8(1):1–8.
  175. STmicroelectronics (2019). No Title.
  176. Annealing of metastable defects in hydrogenated amorphous silicon. Phys. Rev. 8, 34(1).
  177. Über die irreversiblen Änderungen des elektrischen Widerstandes und des Lichtreflexionsvermögens von bei tiefen Temperaturen kondensierten Antimon-, Arsen-, Tellur-, Eisen- und Silberschichten. Zeitschrift für Phys., 115(1-2):17–46.
  178. One-dimensional phase-change nanostructure: Germanium telluride nanowire. J. Phys. Chem. C, 111(6):2421–2425.
  179. Logic design within memristive memories using memristor-aided loGIC (MAGIC). IEEE Trans. Nanotechnol., 15(4):635–650.
  180. Determination of the activation energy spectrum of structural relaxation in metallic glasses using calorimetric and shear modulus relaxation data. J. Appl. Phys., 116(12).
  181. Stochastic phase-change neurons. Nat. Nanotechnol., 11(8):693–699.
  182. Turnbull, D. (1969). Under What Conditions Can A Glass Be Formed? Contemp. Phys., 10(5):473–488.
  183. Electrical resistivity of molten indium–antimony alloys. J. Appl. Phys., 87(9):4623–4625.
  184. Atomic force microscopy study of laser induced phase transitions in Ge2Sb2Te5. J. Appl. Phys., 86(10):5879–5887.
  185. Impulse stimulated ‘explosive’ crystallization of sputter deposited amorphous (In,Ga)Sb films. Solid State Commun., 27(1):17–20.
  186. Role of activation energy in resistance drift of amorphous phase change materials. Front. Phys., 2(December):1–12.
  187. The gradual nature of threshold switching. New J. Phys., 16.
  188. Self-Healing of a Confined Phase Change Memory Device with a Metallic Surfactant Layer. Adv. Mater., 30(9):1705587.
  189. Towards ultimate scaling limits of phase-change memory. Tech. Dig. - Int. Electron Devices Meet. IEDM, 0:4.1.1–4.1.4.
  190. Colloidal Phase-Change Materials: Synthesis of Monodisperse GeTe Nanoparticles and Quantification of Their Size-Dependent Crystallization. Chem. Mater., 30(17):6134–6143.
  191. Origin and consequences of the compensation (Meyer-Neldel) law. Phys. Rev. B, 46(19):12244–12250.
  192. Characterization of nitrogen-doped Sb2 Te3 films and their application to phase-change memory. J. Appl. Phys., 102(6):1–6.
  193. Unveiling the structural origin to control resistance drift in phase-change memory materials. Mater. Today, 41(December):156–176.
  194. Formation of monatomic metallic glasses through ultrafast liquid quenching. Nature, 512(7513):177–180.
  195. One order of magnitude faster phase change at reduced power in Ti-Sb-Te. Nat. Commun., 5(May):1–6.
  196. Structural origin of resistance drift in amorphous GeTe. Phys. Rev. B, 93(11):1–12.

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