Automotive chiplet and three-dimensional thermal coupling

Characterize cross-die thermal leakage on automotive packages by instrumenting memory-die sensors under perception workloads and quantify floorplanning Side-channel Vulnerability Factor reductions within autonomous-vehicle thermal envelopes.

Background

Prior design-time studies suggest that thermal activity can leak across dies in three-dimensional integrated circuits, but the paper notes that these claims have not been validated for automotive packages. Increasing compute density and chiplet integration make such coupling relevant to autonomous-vehicle systems, where sensors on one die may observe activity on another despite logical isolation. The open research task is therefore both empirical package characterization and evaluation of floorplanning mitigations under automotive thermal constraints.

References

Cross-die leakage arguments from Gu et al. and Knechtel and Sinanoglu are design-time and unvalidated on automotive packages.

— Can Autonomous Vehicles Keep Their Cool? A Survey of Thermal Side-Channel and Perception Attacks  (2610.21034 - Aaryan et al., 15 Oct 2026) in Section 6, subsection “Open Problems,” item “Chiplet and 3D thermal coupling”