Paving the Way for Pass Disturb Free Vertical NAND Storage via A Dedicated and String-Compatible Pass Gate (2403.04981v1)
Abstract: In this work, we propose a dual-port cell design to address the pass disturb in vertical NAND storage, which can pass signals through a dedicated and string-compatible pass gate. We demonstrate that: i) the pass disturb-free feature originates from weakening of the depolarization field by the pass bias at the high-${V}{TH}$ (HVT) state and the screening of the applied field by channel at the low-${V}{TH}$ (LVT) state; ii) combined simulations and experimental demonstrations of dual-port design verify the disturb-free operation in a NAND string, overcoming a key challenge in single-port designs; iii) the proposed design can be incorporated in a highly scaled vertical NAND FeFET string and the pass gate can be incorporated into the existing 3D NAND with the negligible overhead of the pass gate interconnection through a global bottom pass gate contact in the substrate.
- Compagnoni, C. M. et al. Reviewing the evolution of the nand flash technology. Proceedings of the IEEE 105, 1609–1633 (2017).
- Jang, J. et al. Vertical cell array using tcat (terabit cell array transistor) technology for ultra high density nand flash memory. In 2009 Symposium on VLSI Technology, 192–193 (IEEE, 2009).
- Goda, A. Recent progress on 3d nand flash technologies. Electronics 10, 3156 (2021).
- Kim, J. et al. Novel vertical-stacked-array-transistor (vsat) for ultra-high-density and cost-effective nand flash memory devices and ssd (solid state drive). In 2009 Symposium on VLSI Technology, 186–187 (IEEE, 2009).
- 3d nand scaling in the next decade. In 2022 International Electron Devices Meeting (IEDM), 26–1 (IEEE, 2022).
- Hynix, S. Sk hynix showcases samples of world’s first 321-layer nand. URL https://news.skhynix.com/sk-hynix-showcases-samples-of-worlds-first-321-layer-nand/.
- Goda, A. 3-d nand technology achievements and future scaling perspectives. IEEE Transactions on Electron Devices 67, 1373–1381 (2020).
- Ferroelectricity in hafnium oxide thin films. Applied Physics Letters 99 (2011).
- The fundamentals and applications of ferroelectric hfo2. Nature Reviews Materials 7, 653–669 (2022).
- Florent, K. et al. First demonstration of vertically stacked ferroelectric al doped hfo 2 devices for nand applications. In 2017 Symposium on VLSI Technology, T158–T159 (IEEE, 2017).
- Zeng, B. et al. Electric field gradient-controlled domain switching for size effect-resistant multilevel operations in hfo2-based ferroelectric field-effect transistor. Advanced Functional Materials 31, 2011077 (2021).
- Zeng, B. et al. 2-bit/cell operation of hf 0.5 zr 0.5 o 2 based fefet memory devices for nand applications. IEEE Journal of the Electron Devices Society 7, 551–556 (2019).
- Comprehensive variability analysis in dual-port fefet for reliable multi-level-cell storage. IEEE Transactions on Electron Devices 69, 5316–5323 (2022).
- Mulaosmanovic, H. et al. Impact of read operation on the performance of hfo 2-based ferroelectric fets. IEEE Electron Device Letters 41, 1420–1423 (2020).
- Array architectures for 3-d nand flash memories. Proceedings of the IEEE 105, 1634–1649 (2017).
- Prince, B. Vertical 3D memory technologies (John Wiley & Sons, 2014).
- Aritome, S. NAND flash memory technologies (John Wiley & Sons, 2015).
- Inside NAND flash memories (Springer Science & Business Media, 2010).
- Suh, K.-D. et al. A 3.3 v 32 mb nand flash memory with incremental step pulse programming scheme. IEEE Journal of Solid-State Circuits 30, 1149–1156 (1995).
- Natural local self-boosting effect in 3d nand flash memory. IEEE Electron Device Letters 38, 1236–1239 (2017).
- Mulaosmanovic, H. et al. Ferroelectric transistors with asymmetric double gate for memory window exceeding 12 v and disturb-free read. Nanoscale 38, 16258–16266 (2021).
- Zhao, Z. et al. Powering disturb-free reconfigurable computing and tunable analog electronics with dual-port ferroelectric fet. ACS Applied Materials & Interfaces 15, 54602–54610 (2023).
- Dünkel, S. et al. A fefet based super-low-power ultra-fast embedded nvm technology for 22nm fdsoi and beyond. In 2017 IEEE International Electron Devices Meeting (IEDM), 19–7 (IEEE, 2017).
- Park, K.-T. et al. Three-dimensional 128 gb mlc vertical nand flash memory with 24-wl stacked layers and 50 mb/s high-speed programming. IEEE Journal of Solid-State Circuits 50, 204–213 (2014).
- Mulaosmanovic, H. et al. Ferroelectric field-effect transistors based on hfo2: a review. Nanotechnology (2021).