Origin of exceptionally low uncorrected frequency scatter

Determine how a frequency scatter as low as \(\sigma=4.7\times10^{-4}\) can be obtained without post-fabrication correction in microwave kinetic inductance detector arrays fabricated using the same electron-beam process, including whether specific detector designs provide greater resilience to fabrication-induced variations.

Background

The paper discusses frequency scatter as a principal limitation on the yield of densely multiplexed microwave kinetic inductance detector arrays. Fabrication-induced variations in resonator geometry and material properties typically produce frequency scatter in the range σ=10−3\sigma=10^{-3} to 10−210^{-2}, while post-fabrication trimming is generally required to reach values sufficiently low for high multiplexing factors.

A value of σ=4.7×10−4\sigma=4.7\times10^{-4} had previously been reported without post-fabrication correction. The paper notes that the mechanism enabling this unusually low scatter is not understood, particularly because the authors use the same electron-beam fabrication process for their own arrays and obtain substantially larger scatter before trimming. Resolving this issue could clarify which resonator-design features or fabrication conditions suppress sensitivity to process variations.

References

It is unknown how such low values for frequency scatter could be obtained, but it seems that the detector design used is more resilient to fabrication-induced variations as we use the same electron-beam fabrication process for our arrays.

— Post-fabrication trimming of a 1024-pixel, single-photon counting, Microwave Kinetic Inductance Detector array with a pixel pitch of 150 micron  (2609.10146 - Ras-Vinke et al., 9 Sep 2026) in Section 2.1, “Yield and frequency scatter”