Imaging thick objects with deep-sub-angstrom resolution and deep-sub-picometer precision (2502.18294v1)

Abstract: Size effects are ubiquitous in the structural, mechanical, and physical properties of materials, making it highly desirable to study the intrinsic properties of thick objects through high-resolution structural analysis in transmission electron microscopy. Although deep-sub-angstrom resolution has been achieved with multislice electron ptychography, the sample thickness is typically very limited. By combining energy filtering and extended local-orbital ptychography (eLOP) that retrieves varying aberrations during electron scanning, here we report ptychographic reconstructions for silicon as thick as 85 nm, approximately three times larger than usual thickness threshold for conventional multislice electron ptychography. The elimination of aberration variations contributes to accurate reconstructions with an information limit of 18 pm and atomic position precision of 0.39 pm. Accurate ptychographic reconstructions for thick objects can facilitate the discovery or interpretation of intrinsic structural and physical phenomena in solids, which is of great significance in physics, chemistry, materials science, and semiconductor device engineering.