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SolderlessPCB: Reusing Electronic Components in PCB Prototyping through Detachable 3D Printed Housings (2403.18797v1)

Published 27 Mar 2024 in cs.HC

Abstract: The iterative prototyping process for printed circuit boards (PCBs) frequently employs surface-mounted device (SMD) components, which are often discarded rather than reused due to the challenges associated with desoldering, leading to unnecessary electronic waste. This paper introduces SolderlessPCB, a collection of techniques for solder-free PCB prototyping, specifically designed to promote the recycling and reuse of electronic components. Central to this approach are custom 3D-printable housings that allow SMD components to be mounted onto PCBs without soldering. We detail the design of SolderlessPCB and the experiments conducted to evaluate its design parameters, electrical performance, and durability. To illustrate the potential for reusing SMD components with SolderlessPCB, we discuss two scenarios: the reuse of components from earlier design iterations and from obsolete prototypes. We also provide examples demonstrating that SolderlessPCB can handle high-current applications and is suitable for high-speed data transmission. The paper concludes by discussing the limitations of our approach and suggesting future directions to overcome these challenges.

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References (65)
  1. Adafruit. 2022. Half Sized Premium Breadboard. https://www.adafruit.com/product/64
  2. Anycubic. 2020. Anycubic UV Tough Resin. https://www.anycubic.com/products/anycubic-uv-tough-resin?variant=40893986603170
  3. A review on epoxy-based electrically conductive adhesives. International Journal of Adhesion and Adhesives 99 (2020), 102596. https://doi.org/10.1016/j.ijadhadh.2020.102596
  4. Designing with Alganyl. In Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction (Daejeon, Republic of Korea) (TEI ’22). Association for Computing Machinery, New York, NY, USA, Article 2, 14 pages. https://doi.org/10.1145/3490149.3501308
  5. SCOBY BREASTPLATE: SLOWLY GROWING A MICROBIAL INTERFACE. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction (Warsaw, Poland) (TEI ’23). Association for Computing Machinery, New York, NY, USA, Article 34, 15 pages. https://doi.org/10.1145/3569009.3572805
  6. ReClaym our Compost: Biodegradable Clay for Intimate Making. In Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems (CHI ’22). Association for Computing Machinery, New York, NY, USA, Article 454, 15 pages. https://doi.org/10.1145/3491102.3517711
  7. A novel approach for development of printed circuit board from biofiber based composites. Polymer Composites 41, 11 (2020), 4550–4558. https://doi.org/10.1002/pc.25732
  8. Eli Blevis. 2007. Sustainable Interaction Design: Invention & Disposal, Renewal & Reuse. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (San Jose, California, USA) (CHI ’07). Association for Computing Machinery, New York, NY, USA, 503–512. https://doi.org/10.1145/1240624.1240705
  9. Further Connecting Sustainable Interaction Design with Sustainable Digital Infrastructure Design. In Proceedings of the 2017 Workshop on Computing Within Limits (Santa Barbara, California, USA) (LIMITS ’17). Association for Computing Machinery, New York, NY, USA, 71–83. https://doi.org/10.1145/3080556.3080568
  10. Recycling ZnTe, CdTe, and Other Compound Semiconductors by Ambipolar Electrolysis. Journal of the American Chemical Society 133, 49 (2011), 19971–19975. https://doi.org/10.1021/ja208577j
  11. Virginia Braun and Victoria Clarke. 2006. Using thematic analysis in psychology. Qualitative Research in Psychology 3, 2 (2006), 77–101. https://doi.org/10.1191/1478088706qp063oa
  12. Allen Buckroyd. 2015. In–Circuit Testing. Butterworth-Heinemann. https://books.google.com/books?id=GD8BvwEACAAJ
  13. 3D Printable Play-Dough. In Extended Abstracts of the 2023 CHI Conference on Human Factors in Computing Systems (CHI EA ’23). Association for Computing Machinery, New York, NY, USA, Article 428, 4 pages. https://doi.org/10.1145/3544549.3583927
  14. Albert Chen. 2013. Why Signal Always Be Loss in a High Speed High Frequency Transmission Line. concern 1, 4 (2013), 8GHz. https://www.circuitinsight.com/pdf/signal_loss_high_speed_high_frequency_ipc.pdf
  15. Silver Tape: Inkjet-Printed Circuits Peeled-and-Transferred on Versatile Substrates. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 4, 1, Article 6 (mar 2020), 17 pages. https://doi.org/10.1145/3381013
  16. Functional Destruction: Utilizing Sustainable Materials’ Physical Transiency for Electronics Applications. In Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (CHI ’23). Association for Computing Machinery, New York, NY, USA, Article 366, 16 pages. https://doi.org/10.1145/3544548.3580811
  17. Kristin N. Dew and Daniela K. Rosner. 2019. Designing with Waste: A Situated Inquiry into the Material Excess of Making. In Proceedings of the 2019 on Designing Interactive Systems Conference (San Diego, CA, USA) (DIS ’19). Association for Computing Machinery, New York, NY, USA, 1307–1319. https://doi.org/10.1145/3322276.3322320
  18. Elegoo. 2020. Elegoo Mars LCD-SLA 3D Printer. http://en.godsaid3d.com/?attachment_id=17671
  19. Daniel Groeger and Jürgen Steimle. 2018. ObjectSkin: Augmenting Everyday Objects with Hydroprinted Touch Sensors and Displays. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 1, 4, Article 134 (2018), 23 pages. https://doi.org/10.1145/3161165
  20. LIGHT TISSUE: Development of Cellulose-Based Optical Textile Sensors. In Proceedings of the Seventeenth International Conference on Tangible, Embedded, and Embodied Interaction (Warsaw, Poland) (TEI ’23). Association for Computing Machinery, New York, NY, USA, Article 27, 14 pages. https://doi.org/10.1145/3569009.3572798
  21. FabricatINK: Personal Fabrication of Bespoke Displays Using Electronic Ink from Upcycled E Readers. In Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems (New Orleans, LA, USA) (CHI ’22). Association for Computing Machinery, New York, NY, USA, Article 173, 15 pages. https://doi.org/10.1145/3491102.3501844
  22. Metal recovery from waste printed circuit boards: A review for current status and perspectives. Resources, Conservation and Recycling 157 (2020), 104787. https://doi.org/10.1016/j.resconrec.2020.104787
  23. Advancements in the treatment and processing of electronic waste with sustainability: a review of metal extraction and recovery technologies. Green Chem. 21 (2019), 919–936. Issue 5. https://doi.org/10.1039/C8GC03688H
  24. Biodegradable Materials for Multilayer Transient Printed Circuit Boards. Advanced Materials 26, 43 (2014), 7371–7377. https://doi.org/10.1002/adma.201403164 arXiv:https://onlinelibrary.wiley.com/doi/pdf/10.1002/adma.201403164
  25. Advanced recycling of post-consumer solid wood and MDF. Wood Material Science & Engineering 14, 1 (2019), 19–23. https://doi.org/10.1080/17480272.2018.1427144
  26. Fabricating Wooden Circuit Boards by Laser Beam Machining. In Adjunct Proceedings of the 34th Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’21 Adjunct). Association for Computing Machinery, New York, NY, USA, 109–111. https://doi.org/10.1145/3474349.3480191
  27. Steven J. Jackson and Laewoo Kang. 2014. Breakdown, Obsolescence and Reuse: HCI and the Art of Repair. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (Toronto, Ontario, Canada) (CHI ’14). Association for Computing Machinery, New York, NY, USA, 449–458. https://doi.org/10.1145/2556288.2557332
  28. Chitin nanofiber transparent paper for flexible green electronics. Advanced Materials 28, 26 (2016), 5169–5175. https://doi.org/10.1002/adma.201600336
  29. Jiva. 2023. The World’s First Fully Recyclable Printed Circuit Board Laminate. https://www.jivamaterials.com/.
  30. When the Material Grows: A Case Study on Designing (with) Mycelium-based Materials. International Journal of Design 12, 2 (2018), 119 – 136. https://www.ijdesign.org/index.php/IJDesign/article/viewFile/2918/817
  31. Instant Inkjet Circuits: Lab-Based Inkjet Printing to Support Rapid Prototyping of UbiComp Devices. In Proceedings of the 2013 ACM International Joint Conference on Pervasive and Ubiquitous Computing (Zurich, Switzerland) (UbiComp ’13). Association for Computing Machinery, New York, NY, USA, 363–372. https://doi.org/10.1145/2493432.2493486
  32. Sunyoung Kim and Eric Paulos. 2011. Practices in the Creative Reuse of E-Waste. In Proceedings of the SIGCHI Conference on Human Factors in Computing Systems (Vancouver, BC, Canada) (CHI ’11). Association for Computing Machinery, New York, NY, USA, 2395–2404. https://doi.org/10.1145/1978942.1979292
  33. Design Patterns, Principles, and Strategies for Sustainable HCI. In Proceedings of the 2016 CHI Conference Extended Abstracts on Human Factors in Computing Systems (San Jose, California, USA) (CHI EA ’16). Association for Computing Machinery, New York, NY, USA, 3581–3588. https://doi.org/10.1145/2851581.2856497
  34. Prototyping Soft Devices with Interactive Bioplastics. In Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology (Bend, OR, USA) (UIST ’22). Association for Computing Machinery, New York, NY, USA, Article 19, 16 pages. https://doi.org/10.1145/3526113.3545623
  35. Development of a 3D printer–scanner hybrid from e-waste. International Journal of Environmental Science and Technology 19, 3 (2021), 1447–1456. https://doi.org/10.1007/s13762-021-03131-6
  36. Exploring Biofoam as a Material for Tangible Interaction. In Proceedings of the 2022 ACM Designing Interactive Systems Conference (DIS ’22). Association for Computing Machinery, New York, NY, USA, 1525–1539. https://doi.org/10.1145/3532106.3533494
  37. Introducing the Sustainable Prototyping Life Cycle for Digital Fabrication to Designers. In Proceedings of the 2020 ACM Designing Interactive Systems Conference (Eindhoven, Netherlands) (DIS ’20). Association for Computing Machinery, New York, NY, USA, 1301–1312. https://doi.org/10.1145/3357236.3395510
  38. An Adaptive Impedance-Matching Network Based on a Novel Capacitor Matrix for Wireless Power Transfer. IEEE Transactions on Power Electronics 29, 8 (2014), 4403–4413. https://doi.org/10.1109/TPEL.2013.2292596
  39. EcoEDA: Recycling E-Waste During Electronics Design. In Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology (UIST ’23). Association for Computing Machinery, New York, NY, USA, Article 30, 14 pages. https://doi.org/10.1145/3586183.3606745
  40. Leah Maestri and Ron Wakkary. 2011. Understanding repair as a creative process of everyday design. In Proceedings of the 8th ACM Conference on Creativity and Cognition (Atlanta, Georgia, USA) (C&C ’11). Association for Computing Machinery, New York, NY, USA, 81–90. https://doi.org/10.1145/2069618.2069633
  41. Dismantling of Printed Circuit Boards Enabling Electronic Components Sorting and Their Subsequent Treatment Open Improved Elemental Sustainability Opportunities. Sustainability 13, 18 (2021). https://doi.org/10.3390/su131810357
  42. Adaptive Wireless Power Transfer and Backscatter Communication for Perpetual Operation of Wireless Brain–Computer Interfaces. Proc. IEEE 110, 1 (2022), 89–106. https://doi.org/10.1109/JPROC.2021.3130059
  43. Associations of neonatal lead, cadmium, chromium and nickel co-exposure with DNA oxidative damage in an electronic waste recycling town. Science of The Total Environment 472 (2014), 354–362. https://doi.org/10.1016/j.scitotenv.2013.11.032
  44. LaserFactory: A Laser Cutter-Based Electromechanical Assembly and Fabrication Platform to Make Functional Devices & Robots. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems (Yokohama, Japan) (CHI ’21). Association for Computing Machinery, New York, NY, USA, Article 663, 15 pages. https://doi.org/10.1145/3411764.3445692
  45. Toward Growable Robot : Exploring and Integrating Flexible – Biological Matter with Electronics. In 2018 International Flexible Electronics Technology Conference (IFETC). 1–4. https://doi.org/10.1109/IFETC.2018.8584034
  46. RESIONE. 2020. RESIONE F39/F69 Material Datasheet. https://www.resione.com/products/f39-white-flexible-rubber-like-3d-printer-resin-1kg-1
  47. Designing a Sustainable Material for 3D Printing with Spent Coffee Grounds. In Proceedings of the 2023 ACM Designing Interactive Systems Conference (Pittsburgh, PA, USA) (DIS ’23). Association for Computing Machinery, New York, NY, USA, 294–311. https://doi.org/10.1145/3563657.3595983
  48. Mohammad S Sharawi. 2004. Practical issues in high speed PCB design. IEEE Potentials 23, 2 (2004), 24–27. https://doi.org/10.1109/MP.2004.1289994
  49. Practical Notes on Paper Circuits. In Proceedings of the 2014 Conference on Designing Interactive Systems (Vancouver, BC, Canada) (DIS ’14). Association for Computing Machinery, New York, NY, USA, 483–492. https://doi.org/10.1145/2598510.2602965
  50. Towards Decomposable Interactive Systems: Design of a Backyard-Degradable Wireless Heating Interface. In Proceedings of the 2022 CHI Conference on Human Factors in Computing Systems (New Orleans, LA, USA) (CHI ’22). Association for Computing Machinery, New York, NY, USA, Article 100, 12 pages. https://doi.org/10.1145/3491102.3502007
  51. Katherine W Song and Eric Paulos. 2021. Unmaking: Enabling and Celebrating the Creative Material of Failure, Destruction, Decay, and Deformation. In Proceedings of the 2021 CHI Conference on Human Factors in Computing Systems (CHI ’21). Association for Computing Machinery, New York, NY, USA, Article 429, 12 pages. https://doi.org/10.1145/3411764.3445529
  52. Katherine Wei Song and Eric Paulos. 2023. Vim: Customizable, Decomposable Electrical Energy Storage. In Proceedings of the 2023 CHI Conference on Human Factors in Computing Systems (CHI ’23). Association for Computing Machinery, New York, NY, USA, Article 180, 18 pages. https://doi.org/10.1145/3544548.3581110
  53. A review on poly lactic acid (PLA) as a biodegradable polymer. Polymer Bulletin 80, 2 (2023), 1179–1213. https://doi.org/10.1007/s00289-022-04160-y
  54. Eldy S. Lazaro Vasquez and Katia Vega. 2019a. From plastic to biomaterials: prototyping DIY electronics with mycelium. In Adjunct Proceedings of the 2019 ACM International Joint Conference on Pervasive and Ubiquitous Computing and Proceedings of the 2019 ACM International Symposium on Wearable Computers (London, United Kingdom) (UbiComp/ISWC ’19 Adjunct). Association for Computing Machinery, New York, NY, USA, 308–311. https://doi.org/10.1145/3341162.3343808
  55. Eldy S. Lazaro Vasquez and Katia Vega. 2019b. Myco-Accessories: Sustainable Wearables with Biodegradable Materials. In Proceedings of the 2019 ACM International Symposium on Wearable Computers (London, United Kingdom) (ISWC ’19). Association for Computing Machinery, New York, NY, USA, 306–311. https://doi.org/10.1145/3341163.3346938
  56. Printed Paper Actuator: A Low-Cost Reversible Actuation and Sensing Method for Shape Changing Interfaces. In Proceedings of the 2018 CHI Conference on Human Factors in Computing Systems (Montreal QC, Canada) (CHI ’18). Association for Computing Machinery, New York, NY, USA, 1–12. https://doi.org/10.1145/3173574.3174143
  57. Urinary heavy metal levels and relevant factors among people exposed to e-waste dismantling. Environment International 37, 1 (2011), 80–85. https://doi.org/10.1016/j.envint.2010.07.005
  58. Should Do, Can Do, Can Know: Sustainability and Other Reflections on One Hundred and One Interaction Design Projects. In Proceedings of the Fifth Workshop on Computing within Limits (Lappeenranta, Finland) (LIMITS ’19). Association for Computing Machinery, New York, NY, USA, Article 6, 18 pages. https://doi.org/10.1145/3338103.3338109
  59. Shanel Wu and Laura Devendorf. 2020. Unfabricate: Designing Smart Textiles for Disassembly. In Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’20). Association for Computing Machinery, New York, NY, USA, 1–14. https://doi.org/10.1145/3313831.3376227
  60. Future Paradigms for Sustainable Making. In Adjunct Proceedings of the 36th Annual ACM Symposium on User Interface Software and Technology (UIST ’23 Adjunct). Association for Computing Machinery, New York, NY, USA, Article 109, 3 pages. https://doi.org/10.1145/3586182.3617433
  61. Zeyu Yan and Huaishu Peng. 2021. FabHydro: Printing Interactive Hydraulic Devices with an Affordable SLA 3D Printer. In The 34th Annual ACM Symposium on User Interface Software and Technology (Virtual Event, USA) (UIST ’21). Association for Computing Machinery, New York, NY, USA, 298–311. https://doi.org/10.1145/3472749.3474751
  62. Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits with a Fiber Laser Engraver. In Proceedings of the 35th Annual ACM Symposium on User Interface Software and Technology (Bend, OR, USA) (UIST ’22). Association for Computing Machinery, New York, NY, USA, Article 12, 13 pages. https://doi.org/10.1145/3526113.3545652
  63. Dissolvable Metals for Transient Electronics. Advanced Functional Materials 24, 5 (2014), 645–658. https://doi.org/10.1002/adfm.201301847
  64. Novel Recycle Technology for Recovering Gallium Arsenide from Scraped Integrated Circuits. ACS Sustainable Chemistry & Engineering 8, 7 (2020), 2874–2882. https://doi.org/10.1021/acssuschemeng.9b07006
  65. CurveBoards: Integrating Breadboards into Physical Objects to Prototype Function in the Context of Form. In Proceedings of the 2020 CHI Conference on Human Factors in Computing Systems (Honolulu, HI, USA) (CHI ’20). Association for Computing Machinery, New York, NY, USA, 1–13. https://doi.org/10.1145/3313831.3376617
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