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Crossover of Three-Dimensional Topological Insulator of Bi2Se3 to the Two-Dimensional Limit (0911.3706v4)

Published 19 Nov 2009 in cond-mat.mtrl-sci and cond-mat.mes-hall

Abstract: Bi2Se3 is theoretically predicted1 2and experimentally observed2,3 to be a three dimensional topological insulator. For possible applications, it is important to understand the electronic structure of the planar device. In this work, thickness dependent band structure of molecular beam epitaxy grown ultrathin films of Bi2Se3 is investigated by in situ angle-resolved photoemission spectroscopy. An energy gap is observed for the first time in the topologically protected metallic surface states of bulk Bi2Se3 below the thickness of six quintuple layers, due to the coupling between the surface states from two opposite surfaces of the Bi2Se3 film. The gapped surface states exhibit sizable Rashba-type spin-orbit splitting, due to breaking of structural inversion symmetry induced by SiC substrate. The spin-splitting can be controlled by tuning the potential difference between the two surfaces.

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Summary

  • The paper demonstrates that reducing Bi₂Se₃ film thickness below six QL induces a gap in topological surface states via inter-surface coupling.
  • It employs molecular beam epitaxy and in situ ARPES to capture thickness-dependent evolution, including Rashba-type spin splitting from inversion symmetry breaking.
  • Findings bridge 3D TI properties with 2D quantum spin Hall behavior, highlighting potential applications in spintronics and topological quantum computing.

An Examination of Dimensional Crossover in Topological Insulator Bi₂Se₃ Films

This paper explores the dimensional crossover of Bi₂Se₃ from a three-dimensional topological insulator (TI) to its two-dimensional limit. The paper investigates how the electronic properties of Bi₂Se₃ evolve as the thickness of the films, grown using molecular beam epitaxy (MBE), is reduced from a bulk regime (50 quintuple layers, QL) to an ultrathin regime (as thin as 1 QL). Using in situ angle-resolved photoemission spectroscopy (ARPES), the authors provide a detailed understanding of the thickness-dependent electronic and spin structures.

The authors report the observation of an energy gap in the topologically protected surface states when the thickness of the Bi₂Se₃ film is reduced below six QL. This gap formation is attributed to the coupling between the top and bottom surface states due to their close proximity in thinner films. Interestingly, these gapped states exhibit Rashba-type spin-orbit splitting, which the authors attribute to the breaking of structural inversion symmetry induced by the substrate.

Key results highlighted in this paper include:

  • The observation of a Dirac point located below the Fermi level, indicating the presence of intrinsic TIs with minimal impurities.
  • Thickness-dependent evolution of surface states was characterized, showing a transition from gapless to gapped states with Rashba-splitting below six QL.
  • The energy gap opening and Rashba splitting are supported by both ARPES data and model calculations.
  • The thickness-dependent oscillatory transition between quantum spin Hall (QSH) and ordinary insulator phases, predicted theoretically, shows an almost monotonic behavior in the measured gap size across thicknesses.

The findings provide significant implications for the field of spintronics and topological quantum computation. The ability to control the Rashba splitting through substrate-induced band bending, perhaps by gate voltage, offers potential for applications in spintronics devices such as the Datta-Das spin field-effect transistor. Furthermore, the presence of gapless surface states at the interface highlights the robustness of the topological states in these films, which could be highly functional in planar devices.

Theoretically, the paper supports the reduction of a 3D TI model in ultrathin limits to the BHZ model of 2D QSH insulators. The coupling and hybridization of surface states in thin films close to the Fermi level indicate complex interactions that go beyond simplified predictions and suggest nuanced mechanisms inherent to the decreased dimensionality.

Future research could explore the exact nature of the substrate-induced Rashba splitting and its optimization for electronic applications. Moreover, complementary methods such as STM or electrical transport measurements devoid of magnetic fields are recommended to resolve the ordinary insulator versus QSH phase ambiguity at various thicknesses.

Overall, the paper advances the understanding of dimensionality effects in topological insulators and elucidates the tunable properties of ultrathin Bi₂Se₃ films, providing a pathway for their application in next-generation electronic devices.

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