Room-Temperature Sputtered Ultralow-loss Silicon Nitride for Hybrid Photonic Integration (2301.10758v1)

Abstract: Silicon-nitride-on-insulator photonic circuits have seen tremendous advances in many applications, such as on-chip frequency combs, Lidar, telecommunications, and spectroscopy. So far, the best film quality has been achieved with low pressure chemical vapor deposition (LPCVD) and high-temperature annealing (1200 {\deg}C). However, high processing temperature poses challenges to the cointegration of Si3N4 with pre-processed silicon electronic and photonic devices, lithium niobate on insulator (LNOI), and Ge-on-Si photodiodes. This limits LPCVD as a front-end-of-line process. Here, we demonstrate ultralow-loss Silicon nitride photonics based on room-temperature reactive sputtering. Propagation losses as low as 5.4 dB/m after 400 {\deg}C annealing and 3.5 dB/m after 800 {\deg}C annealing are achieved, enabling ring resonators with more than 10 million optical quality factors. To the best of our knowledge, these are the lowest propagation losses achieved with low temperature silicon nitride. This ultralow loss enables threshold powers for optical parametric oscillations to 1.1 mW and enables the generation of bright soliton frequency combs at 1.3 and 1.5 {\mu}m. Our work features a full complementary metal oxide semiconductor (CMOS) compatibility with front-end silicon electronics and photonics, and has the potential for hybrid 3D monolithic integration with III-V-on-Si integrated lasers, and LNOI.