Papers
Topics
Authors
Recent
Gemini 2.5 Flash
Gemini 2.5 Flash
119 tokens/sec
GPT-4o
56 tokens/sec
Gemini 2.5 Pro Pro
43 tokens/sec
o3 Pro
6 tokens/sec
GPT-4.1 Pro
47 tokens/sec
DeepSeek R1 via Azure Pro
28 tokens/sec
2000 character limit reached

Towards Improved Semiconductor Defect Inspection for high-NA EUVL based on SEMI-SuperYOLO-NAS (2404.05862v1)

Published 8 Apr 2024 in cs.CV

Abstract: Due to potential pitch reduction, the semiconductor industry is adopting High-NA EUVL technology. However, its low depth of focus presents challenges for High Volume Manufacturing. To address this, suppliers are exploring thinner photoresists and new underlayers/hardmasks. These may suffer from poor SNR, complicating defect detection. Vision-based ML algorithms offer a promising solution for semiconductor defect inspection. However, developing a robust ML model across various image resolutions without explicit training remains a challenge for nano-scale defect inspection. This research's goal is to propose a scale-invariant ADCD framework capable to upscale images, addressing this issue. We propose an improvised ADCD framework as SEMI-SuperYOLO-NAS, which builds upon the baseline YOLO-NAS architecture. This framework integrates a SR assisted branch to aid in learning HR features by the defect detection backbone, particularly for detecting nano-scale defect instances from LR images. Additionally, the SR-assisted branch can recursively generate upscaled images from their corresponding downscaled counterparts, enabling defect detection inference across various image resolutions without requiring explicit training. Moreover, we investigate improved data augmentation strategy aimed at generating diverse and realistic training datasets to enhance model performance. We have evaluated our proposed approach using two original FAB datasets obtained from two distinct processes and captured using two different imaging tools. Finally, we demonstrate zero-shot inference for our model on a new, originating from a process condition distinct from the training dataset and possessing different Pitch characteristics. Experimental validation demonstrates that our proposed ADCD framework aids in increasing the throughput of imaging tools for defect inspection by reducing the required image pixel resolutions.

Definition Search Book Streamline Icon: https://streamlinehq.com
References (21)
  1. Weiss, M., “Overlay challenges in the era of high-na,” in [Metrology, Inspection, and Process Control XXXVII ], 12496, 1249603, SPIE (2023).
  2. Ouchi, M., Ishikawa, M., Shinoda, S., Toyoda, Y., Yumiba, R., Shindo, H., and Izawa, M., “A trainable die-to-database for fast e-beam inspection: learning normal images to detect defects,” in [Metrology, inspection, and process control for microlithography XXXIV ], 11325, 437–445, SPIE (2020).
  3. Kondo, T., Ban, N., Ebizuka, Y., Toyoda, Y., Yamada, Y., Kashiwa, T., Koike, H., Shindo, H., Charley, A.-L., Saib, M., et al., “Massive metrology and inspection solution for euv by area inspection sem with machine learning technology,” in [Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV ], 11611, 210–219, SPIE (2021).
  4. Lorusso, G. F., Beral, C., Bogdanowicz, J., De Simone, D., Hasan, M., Jehoul, C., Moussa, A., Saib, M., Zidan, M., Severi, J., et al., “Metrology of thin resist for high na euvl,” in [Metrology, Inspection, and Process Control XXXVI ], 12053, 229–240, SPIE (2022).
  5. Dey, B., Halder, S., Khalil, K., Lorusso, G., Severi, J., Leray, P., and Bayoumi, M. A., “Sem image denoising with unsupervised machine learning for better defect inspection and metrology,” in [Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV ], 11611, 245–254, SPIE (2021).
  6. Zidan, M., Dey, B., De Simone, D., Severi, J., Charley, A.-L., Halder, S., Leray, P., De Gendt, S., and Lorusso, G. F., “Extraction of roughness measurements from thin resists with low signal-to-noise-ratio (snr) sem images by applying deep learning denoiser,” in [International Conference on Extreme Ultraviolet Lithography 2022 ], 12292, 137–149, SPIE (2022).
  7. Chang, C.-Y., Chang, J.-W., and Der Jeng, M., “An unsupervised self-organizing neural network for automatic semiconductor wafer defect inspection,” in [Proceedings of the 2005 IEEE International Conference on Robotics and Automation ], 3000–3005, IEEE (2005).
  8. Dey, B., Goswami, D., Halder, S., Khalil, K., Leray, P., and Bayoumi, M. A., “Deep learning-based defect classification and detection in sem images,” in [Metrology, Inspection, and Process Control XXXVI ], PC120530Y, SPIE (2022).
  9. Dey, B., Dehaerne, E., and Halder, S., “Towards improving challenging stochastic defect detection in sem images based on improved yolov5,” in [Photomask Technology 2022 ], 12293, 28–37, SPIE (2022).
  10. Dehaerne, E., Dey, B., Esfandiar, H., Verstraete, L., Suh, H. S., Halder, S., and De Gendt, S., “Yolov8 for defect inspection of hexagonal directed self-assembly patterns: a data-centric approach,” in [38th European Mask and Lithography Conference (EMLC 2023) ], 12802, 286–299, SPIE (2023).
  11. Cheon, S., Lee, H., Kim, C. O., and Lee, S. H., “Convolutional neural network for wafer surface defect classification and the detection of unknown defect class,” IEEE Transactions on Semiconductor Manufacturing 32(2), 163–170 (2019).
  12. Rahman, S. S. M. M., Salomon, M., and DembÉlÉ, S., “Noise analysis to guide denoising of scanning electron microscopy images,” in [2023 9th International Conference on Control, Decision and Information Technologies (CoDIT) ], 1559–1564, IEEE (2023).
  13. Tětková, L. and Hansen, L. K., “Robustness of visual explanations to common data augmentation methods,” in [Proceedings of the IEEE/CVF Conference on Computer Vision and Pattern Recognition ], 3714–3719 (2023).
  14. Buslaev, A., Iglovikov, V. I., Khvedchenya, E., Parinov, A., Druzhinin, M., and Kalinin, A. A., “Albumentations: fast and flexible image augmentations,” Information 11(2), 125 (2020).
  15. DeVries, T. and Taylor, G. W., “Improved regularization of convolutional neural networks with cutout,” arXiv preprint arXiv:1708.04552 (2017).
  16. Zhang, J., Lei, J., Xie, W., Fang, Z., Li, Y., and Du, Q., “Superyolo: Super resolution assisted object detection in multimodal remote sensing imagery,” IEEE Transactions on Geoscience and Remote Sensing 61, 1–15 (2023).
  17. team, R., “YOLO-NAS by Deci Achieves State-of-the-Art Performance on Object Detection Using Neural Architecture Search,” (2023). Accessed: May 12, 2023.
  18. Elsken, T., Metzen, J. H., and Hutter, F., “Neural architecture search: A survey,” Journal of Machine Learning Research 20(55), 1–21 (2019).
  19. Chu, X., Li, L., and Zhang, B., “Make repvgg greater again: A quantization-aware approach,” in [Proceedings of the AAAI Conference on Artificial Intelligence ], 38(10), 11624–11632 (2024).
  20. Terven, J., Córdova-Esparza, D.-M., and Romero-González, J.-A., “A comprehensive review of yolo architectures in computer vision: From yolov1 to yolov8 and yolo-nas,” Machine Learning and Knowledge Extraction 5(4), 1680–1716 (2023).
  21. team, R., “YOLO-NAS by Deci Achieves State-of-the-Art Performance on Object Detection Using Neural Architecture Search.” https://deci.ai/blog/yolo-nas-object-detection-foundation-model/ (2023). Accessed: May 12, 2023.
User Edit Pencil Streamline Icon: https://streamlinehq.com
Authors (7)
  1. Ying-Lin Chen (2 papers)
  2. Jacob Deforce (1 paper)
  3. Vic De Ridder (5 papers)
  4. Bappaditya Dey (18 papers)
  5. Victor Blanco (196 papers)
  6. Sandip Halder (23 papers)
  7. Philippe Leray (8 papers)
Citations (1)

Summary

We haven't generated a summary for this paper yet.

X Twitter Logo Streamline Icon: https://streamlinehq.com
Reddit Logo Streamline Icon: https://streamlinehq.com