Tunable Coupling Architectures with Capacitively Connecting Pads for Large-Scale Superconducting Multi-Qubit Processors (2306.05312v1)

Abstract: We have proposed and experimentally verified a tunable inter-qubit coupling scheme for large-scale integration of superconducting qubits. The key feature of the scheme is the insertion of connecting pads between qubit and tunable coupling element. In such a way, the distance between two qubits can be increased considerably to a few millimeters, leaving enough space for arranging control lines, readout resonators and other necessary structures. The increased inter-qubit distance provides more wiring space for flip-chip process and reduces crosstalk between qubits and from control lines to qubits. We use the term Tunable Coupler with Capacitively Connecting Pad (TCCP) to name the tunable coupling part that consists of a transmon coupler and capacitively connecting pads. With the different placement of connecting pads, different TCCP architectures can be realized. We have designed and fabricated a few multi-qubit devices in which TCCP is used for coupling. The measured results show that the performance of the qubits coupled by the TCCP, such as $T_1$ and $T_2$, was similar to that of the traditional transmon qubits without TCCP. Meanwhile, our TCCP also exhibited a wide tunable range of the effective coupling strength and a low residual ZZ interaction between the qubits by properly tuning the parameters on the design. Finally, we successfully implemented an adiabatic CZ gate with TCCP. Furthermore, by introducing TCCP, we also discuss the realization of the flip-chip process and tunable coupling qubits between different chips.